The systems feature Orbotech’s patented LSO Technology™ which can image ultra-fine lines down to 12µm. For the FC-BGA/FC-CSP production our field proven system supports SAP and modified versions of SAP processes, while ensuring pitch down to 30µm. For advanced BGA/CSP subtractive production, our system provides throughput of up to 160prints per hour.

Most of the IC Substrates manufacturers are already using Orbotech LDI systems to meet their advanced FC-BGA, FC-CSP, BGA/CSP and Modules production needs, to achieve higher yields that significantly lower their bottom-lines costs, while increasing their ROI.